Company Details

  • Hemeixin Electronics Co.,Ltd.

  •  [Guangdong,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Europe , Middle East , North Europe , West Europe , Worldwide
  • Exporter:91% - 100%
  • Certs:ISO/TS16949, ISO14001, ISO9001, UL
Inquiry Basket ( 0 )

Hemeixin Electronics Co.,Ltd.

Home > About Us > Manufacturing Capabilities
About Us
Online Service
Manufacturing Capabilities

When you work with Hemeixinpcb, you receive our knowledge and experience, resulting in high quality printed circuit boards. Learn more about our pcb capabilities below.

MANUFACTURING FORMATS

ODB++,HPGL DXF ,Gerber 274X ,Excellon

MAXIMUM PANEL SIZE

48″X 24″(1200mm X 610mm)

MAXIMUM THICKNESS

394 mil(10mm),Samples of 689mil(17.5mm)

LAYER COUNT

2~58 Layer,68-Layer for Samples

INTERCONNECT FORMATION TYPES

Back Drilled Blind (laser & mechanical)
Dual Diameter Electrically Isolated Thru Hole Buried SMT

ASPECT RATIO

16 : 1

FINISHED HOLE SIZE

6mil (0.15mm) Mechanical Drill
3mil (0.075mm) Laser Drill

BLIND VIA ASPECT RATIO

1.25 : 1

INTERNAL FEATURES

Inner Layer: 2mil/2mil (Hoz),
Outer Layer: 3mil/2mil (Hoz),

EXTERNAL FEATURES

Inner Layer: 3mil/2mil (Hoz),
Outer Layer: 3mil/3mil (Hoz)
Buried Resistors: Dielectric thickness: 14 μm
Capacitance /area: 6.4 nF/in2
Breakdown Voltage: >100V
3M material, no need license
Buried Capacitance: Resistance (ohms/sq) : 25, 50, 100, 200

MATERIALS

FR-4, Halogen-Free, Rogers, BT, PTFE, PPO, PPE,
Polyimide, Hybrid, Bergquist, Arlon, Taconic and etc.

COPPER PROCESSING

20 oz ,30 oz(Sample)

IMPEDANCE SINGLE&DIFFERENTIAL

±10%,±7.5%,±5%

VIA FILL

Vias filled with LPI/hole fill mask Non-conductive
via fill with epoxy hole fill Conductive via fill with copper paste

PRESS FIT

±2mil(0.05mm)

SURFACE FINISHES

Electrolytic Ni/Au (Hard & Soft) ENIG
HASL ENIPIG
Immersion Silver Immersion Tin
Reflowed Tin/Lead OSP

Communicate with Supplier?Supplier
Nancy Zhang Ms. Nancy Zhang
What can I do for you?
Chat Now Contact Supplier