Company Details

  • Hemeixin Electronics Co.,Ltd.

  •  [Guangdong,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Europe , Middle East , North Europe , West Europe , Worldwide
  • Exporter:91% - 100%
  • Certs:ISO/TS16949, ISO14001, ISO9001, UL
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Hemeixin Electronics Co.,Ltd.

Home > About Us > Rigid-flex & flex Capabilities
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Rigid-flex & flex Capabilities

When you work with Hemeixinpcb, you receive our knowledge and experience, resulting in high quality printed circuit boards. Learn more about our Rigid flex&flex capabilities below.

MANUFACTURING

ODB++(preferred)

FORMATS

HPGL DXF


Gerber 274X


Excellon

MAXIMUM PANEL SIZE

10″X 60″(250mm X 1500mm)

BOARD THICKNESS

min≥2mil(0.05mm)

max≤94.5mil(2.4mm),

LAYER COUNT

2~20 Layer

ASPECT RATIO

16:1

FINISHED HOLE SIZE

6mil (0.15mm) Mechanical Drill

4mil (0.10mm) Laser Drill

LINE WIDTH/SPACE

2mil/2mil (Hoz),,

STIFFENER TYPE

PI stiffener, FR4 stiffener

SHIEDING MATERIAL

Shielding film,

Silver Based Polymer Thick Film Ink

IMPEDANCE

±10%

SINGLE&DIFFERENTIAL

SURFACE FINISHES

ENIG ENIPIG

HASL Immersion Tin

OSP Immersion Silver




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