Company Details

  • Hemeixin Electronics Co.,Ltd.

  •  [Guangdong,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Europe , Middle East , North Europe , West Europe , Worldwide
  • Exporter:91% - 100%
  • Certs:ISO/TS16949, ISO14001, ISO9001, UL
  • Description:Hybrid High-Frequency Multilayer PCB, Hybrid Multilayer PCB, Hybrid Laser Via PCB
Inquiry Basket ( 0 )

Hemeixin Electronics Co.,Ltd.

Hybrid High-Frequency Multilayer PCB, Hybrid Multilayer PCB, Hybrid Laser Via PCB

Home > Products > Microwave PCB > Hybrid Dielectric PCB Construction
Product Categories
Online Service

Hybrid Dielectric PCB Construction

Product categories of Hybrid Dielectric PCB Construction, we are specialized manufacturers from China, Hybrid High-Frequency Multilayer PCB, Hybrid Multilayer PCB suppliers/factory, wholesale high-quality products of Hybrid Laser Via PCB R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
View : List Grid
hybrid Dielectric PCB  Prototype Fabrication

The hybrid Dielectric PCB stack-up can be used as one of enablers to improve SI for signals routed on selected layers. For a hybrid PCB stack-up, some layers of the PCB use low loss dielectric while the others are fabricated with the traditional...

China Hybrid High-Frequency Multilayer PCB of with CE
 Click for details
China Hybrid Dielectric PCB Construction Suppliers

Hybrid constructions are also a specialty of Hemeixin with multiple materials laminated together to meet your specifications

Hybrid Dielectric PCB construction


Dear value customer:
Thanks very much for trust and interesting.
Here is a basic checklist of information needed to provide a quote. Please make sure you have indicated:

  • A part number (including revision number) for your design to ease tracking
  • Your deadline for order shipment, known as turnaround (short turnaround increases cost)
  • The quantity of boards required
  • Board thickness (.062 inches, .032 inches, .093 inches). .062 inches is standard
  • Type of board material (FR4, high-temp FR4, Rogers, Teflon, etc). FR4 is standard
  • Number of layers
  • Surface finish (SMOBC, HAL, immersion gold, etc). SMOBC and HAL are standard
  • The color for solder mask and component overlay. Green is standard
  • Copper weight on outer layer (1 oz., 2 oz., etc). 1 oz. is standard
  • Copper weight on inner layers (.5 oz., 1 oz.). Either is standard
  • The minimum trace and space widths in your design
  • Indicate your board dimensions on a mechanical layer
  • Do you want your boards to remain panelized, or supplied individually cut?


Communicate with Supplier?Supplier
Nancy Zhang Ms. Nancy Zhang
What can I do for you?
Chat Now Contact Supplier