Hemeixin Electronics Co.,Ltd.
In PCB design, via refers to a pad with a plated hole that connects copper tracks from one layer of the board to other layer(s). High Density Multilayer PCBs may have what is normally referred to as micro vias micro used as blind vias, which are visible only on one surface, or buried vias, which are visible on neither The advent and extensive use of finer pitch devices and requirements for smaller size PCBs creates new challenges. An exciting solution to these challenges uses a recent, but common Pcb Manufacturing technology with self-descriptive name, [Via In Pad".
HemeixinPCB has created the option of checking the required impedance on the customer's Circuit Board, so as to modify the circuit board, or the tracks and the layer structure if necessary. The impedance is largely determined by the track geometry, the structure of the layers and the dielectric constant (Er) of the materials used.
After making the circuit board, the impedances are checked and recorded. The results of the measurements are available on request at any time.