Hemeixin Electronics Co.,Ltd.
HDI is one of the more complex board fabrication processes we specialize in. We use SBU technology, which allows sequential addition of more pairs of layers to form a multilayer core, to create this type of highly integrated PCB and and Microvia Flex PCB Assembly.
Here is a basic checklist of information needed to provide a quote. Please make sure you have indicated:
Files required for bare-board fabrication: Gerber files, drill files, IPC-356A (optional)
We look forward to serving you.