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HDI (high density interconnection) Circuit Boards and Microvia PCB Technology are inextricably linked. Microvias are minute holes drilled by a laser to generate the electrical connection between the layers in a multilayer Circuit Board.
Via in Pad microvias play a decisive role in the miniaturisation of circuit boards. [Via in Pad[ means that microvia holes are located directly in the solder pads. As microvias are not blind holes no capillary forces arise. The solder deposit fills the minimum hollow space.