Hemeixin Electronics Co.,Ltd.
The process of surface mount SMT PCB Assembly service can be simplified to a single panel: solder paste on the mounting and plug pads; SMC/SMD placement; TMC/TMD insertion; reflow soldering. Double panel: Solder paste-reflow soldering process to complete soldering of double-sided chip components; then solder paste on the B-side via component pads; reverse PCB and insert via components; third reflow weld.
Prototype PCB Assembly One of the most popular technologies and processes in the Electronics Assembly industry today. It is a type of leadless or short lead surface mount component (referred to as SMC/SMD, Chinese called chip component) mounted on the surface of a Printed Circuit Board (PCB) or other substrate surface. Circuit mounting technology for soldering and assembly by means of reflow soldering or dip soldering.
Flexible Circuits Assembly has the advantages of reducing the assembly size and weight of the electronic product, avoiding wiring errors, increasing the flexibility of the organization, improving the reliability, realizing the three-dimensional assembly under different assembly conditions, saving the internal space of the product, reducing the volume of the finished product, and improving the performance of the product. Etc. Flexible Circuits Assembly with various advantages is relatively high in cost cost compared with other products, and has many production processes, high production difficulty, low yield and long production cycle.